Solderless Breadboard 830 Tie Points
Item Description and Features:
This is a new 830 tie point solderless breadboard.
It is great for medium sized projects, Arduino shield prototyping,
and circuit testing.
The board comes with adhesive backing and is stackable.
2 Power Lanes: 200 Points
1 Standard double-strip: 630 Points
830 Tie Points Total
Alpha numeric tie point labeling along the edges
16.5 x 5.4 x 0.85 cm
Accepts 20-29AWG wire
You will Receive:
(1) Solderless Breadboard 830 Total Tie Points, Stackable
Item weight is approximately 0.3 pounds.